Disco Hi-Tec America
- Wafer dicing
- Wafer grinding
- Laser dicing
- Dicing SiC wafer
- Laser tools
Disco Hi-Tec has always been known as the industry standard for saw, grinding and laser tools. Disco’s facility located in, Santa Clara, California can also provide valuable services with their knowledgeable engineers and high-tech tools. Quick turnaround for low to high volume wafer process services with laser dicing, blade dicing and grinding.
- X-Ray inspection systems
Quadra™ Series X-ray inspection takes you beyond optical imaging. Proprietary QuadraNT sealed X-ray tube technology allows you to non-destructively inspect obscured areas inside devices and components at up to 68,000 times magnification.
- Automated Wafer Inspection Systems
Camtek’s systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Memory, CMOS Image Sensors, MEMS and RF, serving the industry’s leading global IDMs, OSATs and foundries. Camtek’s systems are designed to meet the industry roadmap and market requirements.
Contact Us Today For More Information
Get more information about our full line of solutions, including wafer fabrication solutions.