Wafer Process Services Available for Laser Dicing, Blade Dicing and Grinding Disco Hi-Tec has always been known as the industry standard for saw, grinding and laser tools.
Disco’s facility located in, Santa Clara, California can also provide valued services with their knowledgeable engineers and high-tech tools.
Quick Turn Around for low to high volume wafer process services with laser dicing, blade dicing and grinding.
- Wedge Bonding (Fine & Heavy Wire)
- Die Collets & Pick-Up Tools
- Solder Jet Balling
- Nozzles, Ejector Needles, and more…
- Manual Wire Bonders (Wedge, Ball & Dual)
- Multi-Layer Ceramics
- Optical/High Speed Packages
- Insulating Circuit Boards
- Pressed Ceramics
- Electronic Functional Components
Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker tape. For almost 30 years Semiconductor Equipment Corporation has set the standard for high quality dicing tape.
For over 40 years, Semiconductor Equipment Corporation strives to be a leading designer and manufacturer of a wide range of manual and semiautomatic assembly, rework, handling, and test equipment.
- Wafer tape
- Dicing tape
- Grinding tape
- Blue tape
- UV tape
- UV Cure
- Wafer mounter
- Components for Microelectronic Hermetic Packing: Lids/Metal Packages/Lead Frames/Carriers & Ceramic Substrate
- RF & MW: Relay Switches (Blades/Reeds)/Packages/Filters
- PCB Assembly Tools
- Flexible Dies
- Precision Metal Components
Contact Us Today For More Information
Get more information about our full line of solutions, including test & inspection equipment.