Test & Inspection
Equipment

Highest quality solutions for semiconductor test & inspection from leading suppliers.

Camtek

Products include:

Automated Wafer Inspection Systems

Camtek’s systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Memory, CMOS Image Sensors, MEMS and RF, serving the industry’s leading global IDMs, OSATs and foundries. Camtek’s systems are designed to meet the industry roadmap and market requirements.

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Nordson Test and Inspection

Products include:

X-Ray Inspection Systems
Automated Optical Inspection Systems
Multi-Function System with Multi-Reflection Suppression® (MRS®)
Metrology and Inspection Systems
Automated X-ray Metrology

Nordson manufactures innovative precision technology designed to solve problems in an expansive set of diverse end markets. Equipment manufacturing is one of their specialties. They are known for world-class precision engineering, and for manufacturing fully-integrated systems, after-market parts, and consumables. Their wide range of precision manufacturing products are essential to support critical applications in consumer durable, non-durable, industrial, medical, and electronic end markets.

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Royce Instruments

Products include:

Bond Test Systems

The Royce 600 Series Bond Test Instruments are precision-engineered systems designed for wire pull, ball shear, die shear, stud pull, and related mechanical bond tests across a wide range of semiconductor and electronic package types. The series includes three models: the 650 Universal Bond Tester, 620 Multitest Bond Tester, and 610 Dedicated Wire Pull Tester, each built on a rigid, low-deflection frame for exceptional accuracy and repeatability. The 650 offers a motorized 305 × 155 mm XY stage for automated and high-force applications, while the 620 uses a manual “chessman” manipulator for fast, flexible sample positioning. Both models feature interchangeable test modules, allowing users to perform multiple test types on one platform. All systems are operated through Royce’s Bond Test Manager (BTM) software, which provides centralized data management, real-time SPC analysis, and automated report generation. Lab Support in Napa, California, and Manufactured in Minnesota, the 600 Series delivers scalable, long-life performance with worldwide technical support.

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Loranger

Products include:

Burn-in and Test Sockets
- Loranger International Corporation designs and manufactures thousands of socket styles for the
  burn-in and test of semiconductors and electronic components. Some of the socket styles are
  listed below.
  
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Burn-in and Test Printed Circuit Boards
- Loranger International Corporation designs and manufactures thousands of burn-in and test
  printed circuit boards for semiconductors and electronic components. Some of the board
  styles are listed below.
  
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Burn-in and Test Environmental Systems
- Loranger Environmental Burn-In Test Systems are custom designed by our award-winning engineering team.
  Complete Turn -Key systems are available to meet your requirements, with custom signal driver boards,
  sockets, burn-in boards, and monitoring software. Systems are available in various sizes 3-8-and 18
  Cubic Foot work areas with single or multiple chambers per individual system.
  
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Loranger International Corporation (LIC) designs and manufactures burn-in and test sockets, printed circuit
boards and environmental chamber systems for the electronics manufacturing industry. LIC sockets are optimized
for today’s small, fine pitch electronic packages including QFN, as well as for older style packages. LIC
burn-in and test sockets are used worldwide in programs including defense, guidance, automotive, music,
communication and space exploration.

Search the Loranger database of more than 3,500 burn-in and test sockets, including over
1,400 QFN sockets. Or, reach out to us with your package drawing and we’ll recommend a socket for your
application.

Nordson

Products include:

WaferSense®
ReticleSense®

WaferSense and ReticleSense sensors provide real-time measurement and monitoring inside semiconductor process chambers and reticle-handling systems. These devices enable precise calibration of equipment conditions such as leveling, vibration, and particle counts, which streamlines tool qualification and improves process control. By replacing manual checks with automated, data-driven insight, this technology helps facilities optimize throughput, enhance repeatability, and maintain high operational efficiency.