- BSOM Series (Beam Shaping Optic Module) Area Laser Beam Module
- NBOL Series (iNnovation Bonding Optical Laser) Laser System with Internal Cooling System
- LSR Series (Laser Selective Reflow) Area Laser Reflow System
- LCB Series (Laser Compression Bonder) Advanced Laser Bonding System with Compression
Laserssel Corporation is a leading provider of Area Laser selective soldering technology supporting global semiconductor, high-end display, automotive, consumer, military and industrial segments.
- Package development
- Assembly services
- Film assisted molding with dynamic insert technology
- Ag (Silver sintering)
- Reel to Reel molding equipment
Boschman is a high-tech, solution driven Dutch company focusing on advanced packaging solutions. We specialize in the development and supply of advanced transfer molding and sintering systems. We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. We provide a unique one-stop-shop concept – from idea to industrialization – offering our customers one point of contact for all packaging activities. We are a niche player, focused on well-defined high growth market segments for Power Modules + MEMS & Sensors for the Automotive, Industrial, Mobile and Medical market. With focus on technology leadership in Film Assisted Molding (encapsulation) and Ag sintering technology supported by our patented Dynamic Insert Technology.
- Wafer dicing
- Wafer grinding
- Laser dicing
- Dicing SiC wafer
- Laser tools
Disco Hi-Tec has always been known as the industry standard for saw, grinding and laser tools. Disco’s facility located in Santa Clara, California can also provide valuable services with their knowledgeable engineers and high-tech tools. Quick turnaround for low to high volume wafer process services with laser dicing, blade dicing and grinding.
- X-Ray inspection systems
Quadra™ Series X-ray inspection takes you beyond optical imaging. Proprietary QuadraNT sealed X-ray tube technology allows you to non-destructively inspect obscured areas inside devices and components at up to 68,000 times magnification.
- Automated optical inspection systems
Nordson YESTECH is your one-stop resource for automated optical and electronics inspection systems and equipment (AOI). We offer a comprehensive and versatile line of AOI inspection and x-ray systems. Our unique technology, combined with our focus on customer service and satisfaction, makes the Nordson YESTECH line of automated optical inspection systems the best value available today.
- Saw singulation and sorting systems
- Standalone pick-and-place systems
- Customized tooling and conversion kits
Our projects aim to develop a new platform for semiconductor assembly and testing equipment, which benefit our customers with the state-of-art technology, high quality and excellent services.
- Bond testers (Wire pull / Bond shear / Die shear)
- Die sorters (automated & semi-automated)
Royce Instruments Die Sorters range from semi-auto tabletop systems to automatic high speed 300mm systems with wafer map and ink-dot die selection. Wafer map capabilities include multi-project wafers (pizza maps) and a range of industry standard wafer formats.
- Industrial water solutions
ResinTech provides cost effective solutions for treating water, toxic wastewater, and process fluids and can create a total solution for your water treatment needs.
This includes the Helix closed loop wastewater treatment system, which uses ion exchange media to target and recover specific heavy metal ions from wastewater streams. Helix systems are ideal for purifying DI water used in conjunction with semiconductor saws and grinders.
- Wafer tape
- Dicing tape
- Grinding tape
- Blue tape
- UV tape
- UV cure
- Wafer mounter
Semiconductor Equipment Corporation is a small, innovative company that has designed and manufactured back end manual equipment for the semiconductor and related industries since 1975. We strive to be a leading designer and manufacturer of a wide range of manual and semi-automatic assembly, rework, handling, and test equipment. This includes high quality tape for a variety of semiconductor manufacturing applications.
Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker tape.
Contact Us Today For More Information
Get more information about our full line of solutions, including test & inspection equipment.