Assembly Services

Wafer process services for laser dicing, blade dicing and grinding from the industry leaders, Disco Hi-Tec.

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Highest Quality Results with
Fast Turnaround Time

Disco Hi-Tec sets the industry standard for semiconductor saw, grinding and laser tools. Along with being a top-tier vendor, Disco offers contract assembly services performed in their Santa Clara, California facility. Disco’s knowledgeable engineers provide quick turnaround times for low to high volume wafer process services of the highest quality.

Flexible and Economical Services

Disco Hi-Tec’s contract assembly services provide a high-quality and economical option for semiconductor and electronics companies looking to:

  • Launch new products in the start-up stage
  • Efficiently meet fluctuating customer demand
  • Get the highest quality results with no up-front investment
  • Test a limited run of new products

Contract assembly services offer high value for foundries.

  • Lower overhead
  • Simplify your production process
  • Streamline your production supply-chain
  • Easily scale your production to meet demand

Learn More About Contract Assembly Services

Contact us today to learn more about the full line of Contract Assembly Services.

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