Contract
Assembly Services
Disco Hi-Tec America KKM Services: R&D and High-Volume Production support for wafer thinning/grinding, mechanical dicing and Laser Stealth Dicing. Metrology and AOI services also provided.
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TECHNOLOGY
Highest Quality Results with
Fast Turnaround Time
Disco Hi-Tec sets the industry standard for semiconductor saw, grinding and laser tools. Along with being a top-tier vendor, Disco offers contract assembly services performed in their Santa Clara, California facility. Disco’s knowledgeable engineers provide quick turnaround times for low to high volume wafer process services of the highest quality.
Flexible and Economical Services
Disco Hi-Tec’s contract assembly services provide a high-quality and economical option for semiconductor and electronics companies looking to:
- Launch new products in the start-up stage
- Efficiently meet fluctuating customer demand
- Get the highest quality results with no up-front investment
- Test a limited run of new products
Contract assembly services offer high value for foundries.
- Lower overhead
- Simplify your production process
- Streamline your production supply-chain
- Easily scale your production to meet demand
Wire Bonder Service and Support
- PM Service
- Repairs
- Installation
- Training for K&S 4000/4500/4700 and MPP IBond5000 Series Manual Wire
- Bonders
- Custom Tooling Design
- Process Development
- Tech Support
- CAD Process
- PLC Support
Learn More About Contract Assembly Services
Contact us today to learn more about the full line of Contract Assembly Services.