Assembly &
Packaging Materials
Highest quality semiconductor assembly and packaging materials from leading suppliers.
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Wafer Process Services Available for Laser Dicing, Blade Dicing and Grinding Disco Hi-Tec has always been known as the industry standard for saw, grinding and laser tools.
Disco’s facility located in, Santa Clara, California can also provide valued services with their knowledgeable engineers and high-tech tools.
Quick Turn Around for low to high volume wafer process services with laser dicing, blade dicing and grinding.
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Products include:
- Wedge Bonding (Fine & Heavy Wire)
- Die Collets & Pick-Up Tools
- Solder Jet Balling
- Nozzles, Ejector Needles, and more…
- Manual Wire Bonders (Wedge, Ball & Dual)
- 4 Point Probes (4PP) & 4PP Refurbishment Program
MPP is a global leader in the semiconductor marketplace, excelling in both Backend and Frontend processes. With expertise in high-precision expendable tools, they support major packaging processes, applications, and provide probe head solutions for wafer or thin conductive film resistivity tests in the microelectronics industry.
Upgrading K&S 4000/4500/4700 Series Manual Wire Bonders: The K&S 4000/4500/4700 Series Manual Wire Bonders have been on the market since for decades and were presented as End-of-Life (EOL) in 2012 with the release of the new generation iBond5000 Series. When Micro Point Pro (MPP) acquired the manual wire bonder product line in 2016 from K&S and they were able to continue spare parts for a minimum period of five (5) years until Dec 30th, 2018. This means that the factory has not been able to manufacture spare parts to support the 4000/4500/4700 Series Manual Wire Bonders and now those stock parts are limited or no longer available. To be supportive and proactive with customers still using the EOL 4000/4500/4700 Series Manual Wire Bonders, SSI is offering a limited time instant trade-in credit up to $5,000.00 with the purchase of the new generation, iBond5000 Series Manual Wire Bonder. SSI can also offer equipment financing with no upfront fees or hefty deposits required. Contact us today!
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Products include:
- Multi-Layer Ceramics
- Optical/High Speed Packages
- Insulating Circuit Boards
- Pressed Ceramics
- Electronic Functional Components
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Products include:
- Components for Microelectronic Hermetic Packing: Lids/Metal Packages/Lead Frames/Carriers & Ceramic Substrate
- RF & MW: Relay Switches (Blades/Reeds)/Packages/Filters
- PCB Assembly Tools
- Flexible Dies
- Precision Metal Components
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Get more information about our full line of solutions, including test & inspection equipment.