Assembly &
Packaging Equipment

Products include:

• BSOM Series (Beam Shaping Optic Module) Area Laser Beam Module
• NBOL Series (iNnovation Bonding Optical Laser) Laser System with Internal Cooling System
• LSR Series (Laser Selective Reflow) Area Laser Reflow System
• LCB Series (Laser Compression Bonder) Advanced Laser Bonding System with Compression

Laserssel Corporation is a leading provider of Area Laser selective soldering technology supporting global semiconductor, high-end display, automotive, consumer, military and industrial segments, providing quality assembly and packaging equipment.

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Products include:

• Package development
• Assembly services
• Film assisted molding with dynamic insert technology
• Ag (Silver sintering)
• Reel to Reel molding equipment

Boschman is a high-tech, solution driven Dutch company focusing on advanced packaging solutions with quality assembly and packaging equipment. We specialize in the development and supply of advanced transfer molding and sintering systems. We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. We provide a unique one-stop-shop concept – from idea to industrialization – offering our customers one point of contact for all packaging activities. We are a niche player, focused on well-defined high growth market segments for Power Modules + MEMS & Sensors for the Automotive, Industrial, Mobile and Medical market. With focus on technology leadership in Film Assisted Molding (encapsulation) and Ag sintering technology supported by our patented Dynamic Insert Technology.

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Products include:

• Wafer dicing
• Wafer grinding
• Laser dicing
• Dicing SiC wafer
• Laser tools

Disco Hi-Tec has always been known as the industry standard for saw, grinding and laser tools. Disco’s facility located in Santa Clara, California can also provide valuable services with their knowledgeable engineers and high-tech tools, offering the best solutions for assembly and packaging equipment. Quick turnaround for low to high volume wafer process services with laser dicing, blade dicing and grinding.

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Products include:

• X-Ray Inspection Systems
• Automated Optical Inspection Systems
• Multi-Function System with Multi-Reflection Suppression® (MRS®)
• Metrology and Inspection Systems
• Automated X-ray Metrology

Nordson manufactures innovative precision technology designed to solve problems in an expansive set of diverse end markets. Equipment manufacturing is one of their specialties. They are known for world-class precision engineering, and for manufacturing fully-integrated systems, after-market parts, and consumables. Their wide range of precision manufacturing products are essential to support critical applications in consumer durable, non-durable, industrial, medical, and electronic end markets.

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Products include:

• Saw singulation and sorting systems
• Standalone pick-and-place systems
• Customized tooling and conversion kits

Our projects aim to develop a new platform for semiconductor assembly and testing equipment, which benefit our customers with the state-of-art technology, high quality and excellent services.

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Products include:

• Bond testers (Wire pull / Bond shear / Die shear)
• Die sorters (automated & semi-automated)

Royce Instruments Die Sorters range from semi-auto tabletop systems to automatic high speed 300mm systems with wafer map and ink-dot die selection. Wafer map capabilities include multi-project wafers (pizza maps) and a range of industry standard wafer formats.

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Products include:

• Industrial water solutions

ResinTech provides cost effective solutions for treating water, toxic wastewater, and process fluids and can create a total solution for your water treatment needs.

This includes the Helix closed loop wastewater treatment system, which uses ion exchange media to target and recover specific heavy metal ions from wastewater streams. Helix systems are ideal for purifying DI water used in conjunction with semiconductor saws and grinders.

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Products include:

• Wedge Bonding (Fine & Heavy Wire)
• Die Collets & Pick-Up Tools
• Solder Jet Balling
• Nozzles, Ejector Needles, and more…
• Manual Wire Bonders (Wedge, Ball & Dual)
• 4 Point Probes (4PP) & 4PP Refurbishment Program

MPP is a global leader in the semiconductor marketplace, excelling in both Backend and Frontend processes. With expertise in high-precision expendable tools, they support major packaging processes, applications, and provide probe head solutions for wafer or thin conductive film resistivity tests in the microelectronics industry.

Upgrading K&S 4000/4500/4700 Series Manual Wire Bonders: The K&S 4000/4500/4700 Series Manual Wire Bonders have been on the market since for decades and were presented as End-of-Life (EOL) in 2012 with the release of the new generation iBond5000 Series. When Micro Point Pro (MPP) acquired the manual wire bonder product line in 2016 from K&S and they were able to continue spare parts for a minimum period of five (5) years until Dec 30th, 2018. This means that the factory has not been able to manufacture spare parts to support the 4000/4500/4700 Series Manual Wire Bonders and now those stock parts are limited or no longer available. To be supportive and proactive with customers still using the EOL 4000/4500/4700 Series Manual Wire Bonders, SSI is offering a limited time instant trade-in credit up to $5,000.00 with the purchase of the new generation, iBond5000 Series Manual Wire Bonder. SSI can also offer equipment financing with no upfront fees or hefty deposits required. Contact us today!

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Products include:

• Photopolymer Film Lamination
• DIE Attach Film Lamination
• Dry Metal Lift Off
• Backgrind & Temporary Bonding Film Lamination

Established in 1976, Microcontrol Electronic introduced the first worldwide automatic Taper and Detaper on the market in 1984. Since then, hundreds of equipment has been sold all over the world to the most important companies such as Atmel, IBM, Infineon, Intel, Micron, Motorola, Philips, STM, and TI.

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