Disco Hi-Tek America
Wafer Process Services Available for Laser Dicing, Blade Dicing and Grinding
Disco Hi-Tek has always been known as the industry standard for saw, grinding and laser tools. Disco’s facility located in, Santa Clara, California can also provide valued services with their knowledgeable engineers and high-tech tools.
Quick Turn Around for low to high volume wafer process services with laser dicing, blade dicing and grinding.
• Wafer dicing
• Wafer grinding
• Laser dicing
• Dicing SiC wafer
• Laser tools
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), is pleased to announce the launch of its XM8000 Wafer X-ray Metrology Platform at the SEMI European 3D TSV Summit taking place in Grenoble, France 20th – 22nd January 2014.
This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. The XM8000 provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more. In this way the XM8000 can be used as an integral part of the fabrication and packaging of integrated circuits or as part of quality control and product acceptance.
Dr David Bernard, Business Manager Automated X-ray Systems commented “this is an exciting launch of a major new X-ray platform for Nordson DAGE. We are taking the expertise and innovation that we have developed over many years serving the X-ray needs of electronics manufacture and now we can extend this to the necessary X-ray metrology for the ever smaller features that are used in today’s electronics such as TSVs and smaller wafer bumps.”
The XM8000 X-ray platform measures the invisible – fast – so our customers have no hidden surprises.
• Wafer X-Ray Metrology Systems
DESIGNER MOLECULES INC. – DMI
Designer Molecules Inc. (DMI) develops novel reactive chemistries which solve processing, performance and related issues for advanced materials. They create new monomers and functional oligomer products for structural adhesives, electronic materials, dental, and advanced composite resin technology.
• Buffer Layer Coating
• Low Stress Resin and
Polymer System eliminates warpage
• Low Tensile Modulus
• High Electrical Reliability
• Low Temp Cure, High Heat Resistance
The MicroSense PV-6060 is a high accuracy metrology module that offers unparalleled throughput and stability for measurement of solar wafer thickness, wafer total thickness variation (TTV) and wafer resistivity. All measurements are completely non-contact with real time analog outputs, for high throughput without wafer breakage. Designed for simple integration into automated wafer transports, the PV-6060 is intended for use by OEMs manufacturing in-line solar wafer inspection and sorting systems.
Non-Contact Solar Wafer Measurements:
* Wafer Flatness Measurement
* Wafer Thickness and TTV
* Wafer Warpage,Bow,SORI
• Wafer Flatness Measurement
• Wafer Thickness and TTV
• Wafer Warpage,Bow,SORI
• Total Solutions for Industrial Water Recycling
• Closed Loop DI Water, Water Purification, Waste Water Treatment
ADVANCED THERMAL SCIENCES
• Temperature Control Systems
• Single & Multiple Channel Heat Exchangers
• Thermoelectric Chillers