Disco Hi-Tek America
Wafer Process Services Available for Laser Dicing, Blade Dicing and Grinding
Disco Hi-Tek has always been known as the industry standard for saw, grinding and laser tools. Disco’s facility located in, Santa Clara, California can also provide valued services with their knowledgeable engineers and high-tech tools.
Quick Turn Around for low to high volume wafer process services with laser dicing, blade dicing and grinding.
• Wafer dicing
• Wafer grinding
• Laser dicing
• Dicing SiC wafer
• Laser tools