Disco Hi-Tec America
Wafer Process Services Available for Laser Dicing, Blade Dicing and Grinding
Disco Hi-Tec has always been known as the industry standard for saw, grinding and laser tools. Disco’s facility located in, Santa Clara, California can also provide valued services with their knowledgeable engineers and high-tech tools.
Quick Turn Around for low to high volume wafer process services with laser dicing, blade dicing and grinding.
• Wafer dicing
• Wafer grinding
• Laser dicing
• Dicing SiC wafer
• Laser tools
Micro Pro Point
• Wedge Bonding (Fine & Heavy Wire)
• Die Collets & Pick-Up Tools
• Solder Jet Balling
• Nozzles, Ejector Needles, and more…
• Manual Wire Bonders (Wedge, Ball & Dual)
ROKKO LEADFRAMES PTE LTD
• Advanced Leadframe Materials & Electrochemistry
KYOCERA AMERICA INTERNATIONAL
• Electronic Mold Compound & Die Attach Paste Solutions
NGK ELECTRONICS DEVICES, INC.
• Multi-Layer Ceramics
• Optical/High Speed Packages
• Insulating Circuit Boards
• Pressed Ceramics
• Electronic Functional Components
• Wafer,SS Mounting and Plastic Film Frames
Semiconductor Equipment Corporation (SEC)
Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker tape. For almost 30 years Semiconductor Equipment Corporation has set the standard for high quality dicing tape.
For over 40 years, Semiconductor Equipment Corporation strives to be a leading designer and manufacturer of a wide range of manual and semiautomatic assembly, rework, handling, and test equipment.
• Wafer tape
• Dicing tape
• Grinding tape
• Blue tape
• UV tape
• UV Cure
• Wafer mounter
• Thermal and Heat Transfer Components
• Thermal and Getter Lids, Solder Preforms
• Carrier and Ceramic Substrates
• EMI/RFI Shielding Components