Assembly & Packaging Materials

DISCO HI-TEC AMERICA

Wafer Grinding, Saw & Laser Singulation, Dicing Blades, Backgrind Tape, and Backgrind Wheels

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Products Include

• Grinding Wheels, Dicing Blades, and Cutting Solutions

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Products Include

• GAISER Precision Bonding Tools

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ROKKO LEADFRAMES PTE LTD

Products Include

• Advanced Leadframe Materials & Electrochemistry

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KYOCERA AMERICA INTERNATIONAL

Products Include

• Electronic Mold Compound & Die Attach Paste Solutions

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NGK ELECTRONICS DEVICES, INC.

Products Include

• Multi-Layer Ceramics
• Optical/High Speed Packages
• Insulating Circuit Boards
• Pressed Ceramics
• Electronic Functional Components

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Products Include

• Wafer,SS Mounting and Plastic Film Frames

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SEMICONDUCTOR EQUIPMENT CORPORATION

Semiconductor Equipment Corporation is recognized as the leading manufacturer and distributor of standard and customized die handling equipment and semiconductor dicing tape. Since 1975, SEC has installed thousands of production units worldwide for work in packaging and assembly operations including edge emitting lasers, flip chip, surface mount and hi-reliability devices such as ball grid arrays, quad flat packs and multichip modules.

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Products Include

• Dicing Tape

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