Assembly & Packaging Materials

Disco Hi-Tek America

Wafer Process Services Available for Laser Dicing, Blade Dicing and Grinding

Disco Hi-Tek has always been known as the industry standard for saw, grinding and laser tools. Disco’s facility located in, Santa Clara, California can also provide valued services with their knowledgeable engineers and high-tech tools.

Quick Turn Around for low to high volume wafer process services with laser dicing, blade dicing and grinding.

Products Include

• Wafer dicing
• Wafer grinding
• Laser dicing
• Dicing SiC wafer
• Laser tools

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Products Include

• GAISER Precision Bonding Tools

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ROKKO LEADFRAMES PTE LTD

Products Include

• Advanced Leadframe Materials & Electrochemistry

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KYOCERA AMERICA INTERNATIONAL

Products Include

• Electronic Mold Compound & Die Attach Paste Solutions

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NGK ELECTRONICS DEVICES, INC.

Products Include

• Multi-Layer Ceramics
• Optical/High Speed Packages
• Insulating Circuit Boards
• Pressed Ceramics
• Electronic Functional Components

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Products Include

• Wafer,SS Mounting and Plastic Film Frames

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Semiconductor Equipment Corporation (SEC)

Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker tape. For almost 30 years Semiconductor Equipment Corporation has set the standard for high quality dicing tape.

For over 40 years, Semiconductor Equipment Corporation strives to be a leading designer and manufacturer of a wide range of manual and semiautomatic assembly, rework, handling, and test equipment.

Products Include

• Wafer tape
• Dicing tape
• Grinding tape
• Blue tape
• UV tape
• UV Cure
• Wafer mounter

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